A new standard proposal for ISO/TC 213/WG 16 May 8, 2018 Novel circular chirp standards for characterising the instrument transfer function and topography fidelity of areal surface measurement tools. Download here… Read More
EMPIR 14IND07 3D Stack Final Meeting May 8, 2018 Date: 25–26 April 2018 Venue: PTB, Berlin, Germany… Read More
‘Metrology for manufacturing 3D stacked integrated circuits’ Workshop May 8, 2018 Hosted by semi European 3D Summit Date: 24 January 2018 Venue: art’otel Dresden, Germany Agenda: Carlos Betia (CEA Leti): ‘Project objectives – Industrials and R&D institutions expectations’ Djamel Allal (LNE): ‘Metrological issues and challenges for 3D-SIC manufacturing’ Ingrid De Wolf (imec): ‘Assessment of GHz Scanning Acoustic Microscopy (GHz-SAM) for detection of 3D-SIC processing defects’ Gaoliang… Read More
3D Stack Workshop October 2, 2017 Date: 25 September 2017 Venue: CEA Leti Agenda: Elena Dilonardo (CNR-Italy): ‘Analysis and Visualization of Materials by X-ray nano-Computed Tomography (nano-CT)’ and ‘Laboratory Information Metrology Management System’ (via Skype entreprise) Carlos Beitia (CEA): ‘Die level topography traceability measurements challenges’ José Moran (LNE): ‘Combined AFM/STM microscopy based on a quartz tuning fork sensor: surface morphology and… Read More
3D-stacked IC Metrology Workshop December 5, 2016 Date: 15 December 2016 Venue: imec, Leuven, Belgium Details and registration on http://bit.ly/3DstackICmetr… Read More
EMPIR 14IND07 3D Stack Project M9 Meeting December 5, 2016 Date: 29 February 2016 Venue: METAS, Bern, Switzerland See Publishable summary for impact and results to date.… Read More
EMPIR 14IND07 3D Stack Project Kick-off Meeting December 5, 2016 Date: 10 June 2015 Venue: LNE, Paris, France… Read More