The aim of this work package is to enable reliable, high resolution mechanical property mapping using small indentations. This will be achieved in two ways: by improving AFM-based indentation through the generation of new and improved diamond probes by extending the reach of conventional Instrumented indentation testing (IIT) into the regime presently addressed only by AFM based indentation testing. Fig. 2.1. (left) Adama etch-based batch processing showing production of mounted diamond flat punch on steel holder for iNano IIT system. (right) MEMS-based IIT actuator developed by PTB and TUCh.